Intel Core i3 processor scales for COM embedded modules

Concurrent Technologies has designed its latest COM processor module around a low power variant of the 6th generation Intel Core processor, previously known as Skylake-H.

xp b5x/msd

The company has designed the XMC module with a conduction-cooled envelope suitable for use on both custom and open standard based carriers, including VPX and VME.

Designated, XP B5x/msd the COM has a dual-core Intel Core i3-6102E processor with 8Gbyte of DDR4 ECC DRAM.

The attraction of the XP B5x/msd module is that it makes it possible to add an Intel processor module for control, storage and display purposes.

A 64Gbyte solid state disk provides storage for the operating system, application code and data.

Interfaces include a single x8 or dual x4 PCI Express lane along with a range of standard I/O interfaces including Ethernet, USB, SATA, RS232, digital I/O and DisplayPort.

Glen Fawcett, CEO of Concurrent Technologies, writes:

“Most of our products are based around the premise that the Intel processor board is the centre of a solution that scales by adding more boards in a rack or slot type of environment.”

“This XP B5x/msd module turns that concept around, allowing customers with a signal processing board to add an Intel processor module for control, storage and display purposes. This makes it simple to create solutions for applications like image analysis and signals intelligence.”

Air-cooled XP B5x/msd modules are available now and rugged conduction-cooled variants will follow later this year.